SPECIFICATIONS

Well-prepared documentation is essential for a well-made product.

To make the product, we will need the following:

• GERBER files
• BILL OF MATERIALS (Excel file)
• PICK AND PLACE file
• TESTING PROTOCOL (if you require final testing of PCBs)

We always purchase electronic components according to their exact designations declared by the customer. If a particular component is not in stock or the supply period is extremely long, we recommend an alternative product or ask for a suggested replacement option.

Options:

• components supplied by customer
• components partly supplied by the customer and partly by LUZNAR ELECTRONICS d.o.o.
• components entirely supplied by LUZNAR ELECTRONICS d.o.o.

Printing specification:

• Print precision: 20 µ
• Minimum point size: 215 µ
• Minimum point volume: 5 nl
• Maximum panel size for our machine: 508×508 mm
• Circuit thickness: 50µ -> 6,0 mm

Printing advantages:

• Built-in optical paste control
• Automatic paste touch-up
• Printing of glue
• Printing of lead-free paste
• Printing of leaded paste
• Optional combined printing of adhesive and paste
• Replacing the product for assembly 5 min

Installation specifications:

• Speed of assembly: 54.000 components per hour
• Accuracy: ±0,01mm
• Minimum component: 01005 (0,4 x 0,2 mm)
• Maximum component: 75 x 75 mm
• Thickness of PCBs: 50µ -> 4,2 mm
• Maximal panel size for our machine: 500 x 400 mm

Installation advantages:

• Trolleys used for material: allow a fast replacement of products
• The project is replaced in 15 minutes
• Smart feeders: for component traceability

The temperature cannot exceed the boiling point of the fluid, physically preventing overheating of any component. After soldering, a vacuum chamber removes trapped gases and air bubbles from the still-molten joints, ensuring void-free connections (voiding < 5%). The process takes place in a fully inert, oxygen-free atmosphere, improving wetting and eliminating oxidation.

Advantages of vapor phase soldering with vacuum:

• No risk of overheating – temperature limited by the boiling point of Galden fluid (~230 °C)
• Uniform temperature distribution across the entire PCB – including under BGA components and large heat sinks
• Vacuum removes voids from molten solder joints – critical for power and automotive electronics
• Soldering in an inert, oxygen-free atmosphere – no additional nitrogen required
• Suitable for fine-pitch BGA, QFN, power modules (IGBT, MOSFET), and multilayer PCBs with high copper content

In addition, we also examine the inscriptions on the components to eliminate any misplaced components. At LUZNAR ELECTRONICS d.o.o., the circuit boards are also marked with serial numbers, which can help us track the errors during the production process.

SMT optical inspection:

• Camera: 15 mega Pixel
• Resolution: 10µ
• Minimum component: 01005 (0,4×0,2mm)
• Maximum panel size for our machine: 500 x 400mm

Capabilities:

• Robotic cutting of THT capacitors
• Wave soldering of THT components
• Production of 3D soldering masks

At LUZNAR ELECTRONICS d.o.o., we develop measurement protocols, testing devices and provide advice in the preparation of test protocols. We pay close attention to the inspection and calibration of PCBs, as we are well aware that our customers want circuit boards that work 100%.

Electronic devices are becoming more and more visible. This has led us to conclude that PCBs should have a visually appealing design. The demand for PCB cleaning grows every day and LUZNAR ELECTRONICS d.o.o. certainly follows the preferences of its customers.

The PCBs which are exposed to extreme temperatures, humidity, dust and vibrations require additional protection. We can ensure this by providing coating services, applying encapsulation materials and making sure that large components are securely attached.

New equipment coming soon.